DuPont demonstrates GreenTape for AiP
DuPont Microcircuit and Component Materials is collaborating with Industrial Technology Research Institute (ITRI) of Taiwan to demonstrate the value of DuPont GreenTape low temperature co-fired ceramics (LTCC) material used in Antenna in Package (AiP) applications. This collaboration is resulting in an alternative to existing print circuit board options.
In 5G communication, millimetre wave (mmWave) radio frequencies are used to achieve ultra-high speed, large capacity and ultra-low latency. GreenTape LTCC and Argentum conductive pastes are used to form radio frequency components, substrates and AiPs for radio frequency front end modules in 5G mmWave small cells/peripherals.
The LTCC system offers advantages of reliability, electrical performance, thermal conductivity and environmental resistance, which enables a high degree of design freedom.
It is suited for use in RF transceiver devices at 5G mmWave band, such as 28 GHz and 39 GHz.
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