DuPont Pyralux HP laminate adhesive

Wednesday, 26 January, 2022 | Supplied by: DuPont Australia Pty Ltd


DuPont Interconnect Solutions released the Pyralux HP laminate adhesive system at the 2022 Institute for Printed Circuits (IPC) APEX Exposition in San Diego.

High-speed signal transfer across networks creates numerous environments where signal integrity is often diminished, resulting in costly issues for end users. To improve the performance of these devices, DuPont developed the epoxy-based Pyralux HP laminate adhesive system for original equipment manufacturers and printed circuit board (PCB) manufacturers to address the needs in high-performance and high-reliability applications in the telecommunications, networking, medical, industrial, military and aerospace markets.

The laminate adhesive maintains electrical performance in demanding and extreme environment PCB applications. This IPC-certified product is available as a sheet adhesive or as a coverlay, suitable for a wide variety of multi-layer flex and rigid-flex applications. The system enables processing at lower temperatures, providing PCB designers and producers with a range of applications they can support.

Online: www.dupont.com.au
Phone: 1800 789 308
Related Products

Tait Communications TP9900 P25 multiprotocol portable

Tait Communications is releasing a portable radio that should improve communications between...

Hytera S Series business two-way radios

Hytera Communications' S Series business two-way radios have been designed to cater to small...

CTS RLF and XLF series low-pass filters for harmonic suppression

The RLF and XLF series of low-pass filters, from CTS Corporation, are optimised to support 3GPP...


  • All content Copyright © 2024 Westwick-Farrow Pty Ltd