DuPont Pyralux HP laminate adhesive

DuPont Interconnect Solutions released the Pyralux HP laminate adhesive system at the 2022 Institute for Printed Circuits (IPC) APEX Exposition in San Diego.

High-speed signal transfer across networks creates numerous environments where signal integrity is often diminished, resulting in costly issues for end users. To improve the performance of these devices, DuPont developed the epoxy-based Pyralux HP laminate adhesive system for original equipment manufacturers and printed circuit board (PCB) manufacturers to address the needs in high-performance and high-reliability applications in the telecommunications, networking, medical, industrial, military and aerospace markets.

The laminate adhesive maintains electrical performance in demanding and extreme environment PCB applications. This IPC-certified product is available as a sheet adhesive or as a coverlay, suitable for a wide variety of multi-layer flex and rigid-flex applications. The system enables processing at lower temperatures, providing PCB designers and producers with a range of applications they can support.