The Hakko 808 desoldering gun will quickly and safely heat and remove solder from circuit boards and components.
The gun has a thin pistol grip that places the pump and motor above, not inside, the grip, keeps vibration to a minimum and ensures that the grip is comfortable for extended use.
The miniature, high-performance diaphragm pump is housed in the chamber at the rear.
Features include: tip-to-ground potential difference no greater than 2 mV; tip-to-ground resistance no greater than 2Ω; adjustable temperature control (380-480°C); 1.0 mm nozzle installed.
Phone: 1300 656 636
R&S BBA300-F and BBA300-FG broadband amplifiers
The BBA300 family is a range of compact, solid-state broadband amplifiers, designed for high...
STMicroelectronics LEOPOL1 point-of-load converter for LEO applications
STMicroelectronics' LEOPOL1 point-of-load step-down converter has been optimised for LEO...
Jabra Perform 10 corded headset
The Jabra Perform 10 corded headset is purpose-built for customer-facing associates in retail and...
