Integrated RF shielding

RF Micro Devices has introduced its MicroShield integrated RF shielding.

This is claimed to eliminate the need for bulky external shields by integrating RF shielding directly into the RFIC or module and reducing the height and volume requirements for RF sections by up to 50% and provides components that are insensitive to board placement.

RF shielding reduces emissions related to electromagnetic interference (EMI) and radio frequency interference (RFI) and minimises susceptibility to external fields. Traditional RF shielding is implemented with external metal ‘cans’ that encapsulate and shield the RF section of a circuit board.

However, this is costly as the cans must be customised for individual circuit boards. Additionally, external RF shield increase the space requirements for RF sections and, more significantly, can degrade the performance of the underlying RF circuitry.

The company’s shielding reduces the impact of EMI and RFI by minimising exposure to external fields and preventing energy leakage into unwanted areas of the host device. Also, by eliminating sensitivity to board placement it eliminates the risk of circuit retuning.