Suba Engineering VP450 soldering system

The VP450 soldering system has been developed for use in the lab for special applications and small series production. It is suitable for test soldering, for qualifying soldering processes and for soldering sample assemblies. Because of its semiautomatic operation, the system is suitable for small production runs.

In combination with the ASSCON de-soldering system, the appliance can also be used for repairing assemblies.

This soldering system provides all the advantages of modern vapour-phase soldering and enables correct soldering of complex SMD components with lead-free or lead-containing soldering pastes in virtually any arrangement.

Components such as quad flat packages, ball grid arrays, flip chips, cooling elements, SMD SIMM bars or ceramic substrates can all be processed.

Advantages of the system include: non-oxidising heating process in inert vapour zone without additional shielding gases; reproducible process conditions; infinitely variable temperature gradient; energy savings, due to quick start function; electromechanically locked process space; no overheating of electronic assemblies; suitable for lead-free operation without restrictions; even heating of the assemblies without shadings; no time-intensive temperature profile creation; automatic heat transfer medium identification; user-friendly microprocessor control; no dependency on cooling water due to integrated re-cooling system; and suitable for unsoldering components with the ASSCON de-soldering system.