Integrated, 3D EM simulation for RF module design

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Agilent Technologies has announced an integrated design flow solution that includes full 3D EM simulation for RF module design. Called EMDS-for-ADS, the full 3D electromagnetic (EM) simulator is integrated into the company's Advanced Design System EDA software platform and eliminates the need for standalone EM tools.

The simulator helps designers predict the 3D EM interactions of embedded passive components in RF modules while co-simulating with active circuits to maximise the wireless sub-system performance.

The integrated 3D EM simulator improvements allow designers to analyse larger circuits faster without leaving a familiar design flow.

The simulator accounts for the finite dielectric boundaries of RF modules. In addition, it is useful for verifying the accuracy of faster Planar EM simulators such as the company's Momentum, which assumes infinite dielectric planar layers in its analysis.

It also features a finite element mesher and high-capacity iterative solver that delivers better accuracy, speed and capacity for RF SIP (system-in-package) and RF module designs.

Applications for the simulator are RF modules based on LTCC (low temperature co-fired ceramics) and laminates with embedded passive structures that are found in almost all RF modules produced today. It saves time when drawing these structures with its planar RF layout macros. These macros automatically draw RF components such as spiral inductors and meander lines.

The simulator is part of the Agilent Advanced Design System 2008 Update 2. The system is a powerful electronic design automation platform, offering complete integration to designers of consumer and commercial wireless electronic products such as mobile phones, wireless networking and GPS, as well as radar and satellite communications systems, and high-speed digital serial links.