Laird Technologies Tpcm 580SP phase change material series

Laird Technologies has released its Tpcm 580SP series phase change material.

It is a screen printable or stencilable thermal interface material with a thermal conductivity of 4.0 W/mK that provides an alternative to thermal grease.

The PCM pad contains a solvent that assists in processing, which allows wetting the surface. After drying, the solvent is moistureless to the touch.

Once the solvent is removed it begins to soften and flow at temperatures around 45°C, minimising thermal contact resistance by filling in the microscopic irregularities of the components it touches.

Because it softens but does not fully change states; it minimises migration (pump out) under thermal cycling from room temperature to chip device operating temperatures.

The material is available in a 0.5 or 1.0 kg can for manual screen printing and large-volume automatic operations. It is suitable for a variety of applications including high-frequency microprocessors, notebook PCs, desktop PCs, computer servers, DC/DC converters, memory modules, cache chips, IGBTs, and motor vehicle and optical electronics.