STMicroelectronics STM32WL5MOC SiP module

Friday, 19 January, 2024 | Supplied by: STMicroelectronics Pty Ltd


STMicroelectronics has revealed a long-range, low-power IoT system-in-package (SiP) programmable module built with a dual-core STM32WL55JC wireless system-on-chip (SoC), saving time to market for remote metering, monitoring and smart-sensing devices by enabling simple, immediate and effective LPWAN wireless connectivity.

The STM32WL5MOC SiP comes in an LGA92 10 x 10 mm package and combines the SoC with frequency-controlled oscillators; an IC containing balun, filter and matching network; a receive/transmit switch; and associated passives needed for system operation. Bringing these components together in the module enables users to accelerate RF design, save space and simplify circuit-layout challenges, thus saving the time and cost of otherwise complex RF design investments with experienced teams or certifications.

The miniature SiP module enables data communication over a long range while using little power, allowing system-battery lifetime greater than 10 years. Operating in the 864 to 928 MHz band, permitting licence-free use in regions worldwide, the module comes pre-certified for connection to LoRaWAN and Sigfox networks.

The open wireless subsystem supports multiple modulation schemes, including (G)FSK, (G)MSK, BPSK, in addition to LoRa modulation, and is compatible with standard and proprietary protocols such as wM-Bus, Wi-Sun, Mioty and others. The RF output power is selectable up to 22 dBm, as permitted in US and Asian territories, or 15 dBm according to European regulations.

Leveraging the STM32WL55 SoC dual-core architecture with 256 KB Flash and 64 KB RAM on-chip, the module enables real-time performance of the user application. The SoC’s Arm Cortex-M4 core with DSP extensions and Cortex-M0+ both implement memory protection for enhanced security. The Cortex-M0+ has additional secure services including key management, secure firmware install and update, and secure sub-GHz MAC layer. An option with onboard STSAFE-A110 is also available to further strengthen end-to-end data and networking security.

The module is fully integrated in the STM32 development ecosystem and supported within the STM32CubeMX tool for project initialisation and software development. The B-WL5M-SUBG1 wireless prototyping board is also available and contains a STM32WL5MOC module to facilitate evaluation and software integration.

Online: www.st.com
Phone: 02 9158 7200
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