EFD's Solder Paste Group has introduced a water-soluble, halide-free flux system.
The flux specifies 0% halides before and after reflow, and carries a J-STD activity classification of Ormo based on precise chromatographic testing required under the IPC J-STD-004A flux test specifications issued in January.
The system is available with all standard EFD tin/lead and lead-free alloy compositions including Sn/Ag/Cu alloy in both stencil printing and high-performance dispensing paste formulations.
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