EFD's Solder Paste Group has introduced a water-soluble, halide-free flux system.
The flux specifies 0% halides before and after reflow, and carries a J-STD activity classification of Ormo based on precise chromatographic testing required under the IPC J-STD-004A flux test specifications issued in January.
The system is available with all standard EFD tin/lead and lead-free alloy compositions including Sn/Ag/Cu alloy in both stencil printing and high-performance dispensing paste formulations.
STMicroelectronics 100 V trench Schottky rectifier diodes
STMicroelectronics has introduced a range of 100 V trench Schottky rectifier diodes that boost...
Quectel HCM511S high-performance MCU Bluetooth module
Utilising Bluetooth Low Energy 5.4, the module accommodates an ARM Cortex-M33 processor and...
u-blox ALMA-B1 and NORA-B2 Bluetooth LE modules
The ALMA-B1 is a high-end wireless MCU, while the NORA-B2 brings ultralow power to less complex...
