Laird Technologies Tflex XS400 series thermal gap filler
Laird Technologies has released its Tflex XS400 series thermal gap filler.
It provides moderate thermal performance with a conductivity of 2.0 W/mK. The soft interface pad requires minimal pressure, resulting in minimal thermal resistance even at low pressure with little or no stress on mating parts.
Available in thicknesses from 0.50 mm through 5.0 mm in 0.010″ increments, the material is naturally tacky for easy assembly and no adhesive coating is required.
Due to its liner on the other side, it is electrically insulating, stable from -40 to 160°C and is certified to UL 94V0 flammability rating; complying with the limits of RoHS directive 2002/95/EC and its subsequent amendments.
Phone: 03 8669 1210
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